Emtec Electronic attends the Corrugated Week in Indianapolis, USA
For the first time, emtec Electronic GmbH will attend the Corrugated Week in Indianapolis, USA from September 24th to 27th 2018, together with its US representative Technidyne Corporation. At exhibition booth no. 848 the company will present innovative testing instruments for the corrugated board industry.
The special EST12 Surface & Sizing Tester determines those surface parameters of paper and board, which are relevant for the converting process, in particular the surface sizing / hydrophobicity and surface porosity. With its help, converting properties, such as printability, gluability, coatability and dusting tendency can be predicted. It enables the optimal runnability during the finishing or converting process of paper/board. An according modular system PDA.C02 Penetration Dynamics Analyzer for more applications is available.
Alongside with the EST12, emtec will have the CAS touch! and FPA touch! on display. These instruments represent the most-modern charge measuring systems for the wet-end in paper and board production and are used to measure the interaction between particles or fibers with additives and process chemicals in the pulp suspension. The use of both instruments in the production process helps to optimize the utilization of chemicals with the objective to stabilize the process, to improve the product quality and to reduce cost.
The new measuring method to measure the mineral filler content of the ACA Ash Content Analyzer, is nondestructive, quick, easy and accurate. Typical mineral filler and pigment content in paper and board, such as calcium carbonate, kaolin/ talcum, titanium dioxide, and the total mineral filler content in percent are determined. It enables optimal process control due to instant availability of measuring results, and helps to narrow down the specifications for the filler content in the finished product and therefore to optimize the consumption of fillers.
Additionally, emtec Electronic will inform about its DSS Dimension Stability System, a modular measuring system for the investigation of the dimension stability of paper, board and foils in one-sided contact with temperature or liquids. The WSD module Wet Stretch Dynamics Analyzer measures the dynamics of the change in dimension of paper under one- sided liquid contact. And the HSA module Heat Shrinkage Analyzer predicts the dimension stability of paper, board and foils in contact with high temperature during the converting process.